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Marvell Technology, Inc. has claimed the industry’s first 2-nm 64 Gbits/s bi-directional die-to-die (D2D) interconnect, offering higher bandwidth and efficiency together with advanced power management ...
Driven by high-performance networking applications, SerDes has been the primary choice for connecting multiple chips and dies as switches and routers are at the forefront of the bandwidth requirements ...
Marvell Technology has unveiled the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect. Industry first 64 Gbps/wire bi-directional die-to-die Credit: adobe.stock.com This will ...
Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design
SUNNYVALE, Calif., Sept. 3, 2024 /PRNewswire/ -- Blue Cheetah Analog Design and LG Electronics Inc. (LG) announced that they are collaborating and have demonstrated silicon success for a new ...
Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing ...
SANTA CLARA, Calif., Aug. 26, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the industry's first 2nm 64 Gbps bi ...
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