The "Advanced IC Substrates Market Size, Share & Industry Analysis Report By Type, By Technology, By Application, By Regional Outlook and Forecast, 2025-2032" report has been added to ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is undergoing a significant transformation, ...

LG Innotek said Wednesday it has developed a next-generation smart IC substrate that cuts carbon emissions by about half and boosts durability threefold — a bre ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that ...

IC substrate maker Nan Ya Printed Circuit Board (NPC) has reported revenues for May down 1% on month to NT$2.18 billion (US$67 million), while Kinsus Interconnect Technology and Phoenix... IC ...

Murata Electronics North America has introduced the GRU series, the world's thinnest embedded monolithic capacitor for substrates. Using advanced ceramic technology, the new 0402 size capacitor, ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.