Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025 - ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

Samsung Electro-Mechanics and LG Innotek are accelerating their AI semiconductor substrate businesses. Samsung Electro-Mechanics recently started operating its Vietnam flip chip-ball grid array ...

[Asia Economy Reporter Kim Pyeonghwa] Samsung Electro-Mechanics announced on the 26th that it has developed an automotive semiconductor substrate (FC-BGA) applicable to advanced driver assistance ...

To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...

SEOUL, South Korea, April 30, 2025 /PRNewswire/ -- LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the ...

As Japan's Murata, the No. 1 corporations in multilayer ceramic capacitors (MLCC), and Japan's Ibiden, the No. 1 corporations in flip-chip ball grid array (FC-BGA) substrates for artificial ...

SEOUL, South Korea, Feb. 2, 2023 /PRNewswire/ -- LG Innotek (CEO Jeong Cheol-dong) is accelerating the business activities in full-scale for targeting the Flip-Chip Ball Grid Array (hereafter referred ...

With Samsung Electro-Mechanics effectively having sold out next year's production volume of flip-chip ball grid array (FC-BGA), it is said to plan to ramp up the utilization rate of its Vietnam ...

Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...