Heriot-Watt University spin out MicroStencil expects to see its fine-pitch stencil printing technology being used for wafer-scale packaging by Taiwanese and Chinese laptop builders in the next six to ...

Heriot-Watt University spin-out MicroStencil is developing a screen printing stencil which will allow sub-100µm pitch printing of conductive interconnect material directly onto wafers, chips or boards ...

EMS companies who produce PCBA’s have been using stencils for decades, to apply solder paste to boards, but this traditional method may one day be a thing of the past. Adam Harsant, Director at ...

This is one of those fun hacks that come about from finding a product and going “I wonder if I could…” — in this case, artist/YouTuber [Wesley Treat] found out his favourite vendor makes spray cans in ...