Semiconductor Engineering

SiPs: The Best Things in Small Packages

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...
Semiconductor Engineering

A Modular System In Package Approach For Automotive Short Range Radar Applications (Ruhr Univ. Bochum, Fraunhofer et al.)

A new technical paper titled “Leveraging Modularity of Chiplets to Form a 4×4 Automotive FMCW-Radar in an eWLB-Package” was published by researchers at Ruhr University Bochum, Fraunhofer Institute, ...
Nature

Heterogeneous Integration and Packaging Technologies

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...
EDN

GaN system-in-package targets USB-C PD adapters

Weltrend announced its first GaN-based system-in-package integrating an AC/DC controller and Transphorm’s 240-mΩ, 650-V SuperGaN FET. The WT7162RHUG24A is intended for USB Type- C Power Delivery (PD) ...