New Tetra X system breaks the 2nm uniformity barrier to enable critical layer masks at 22nm Delivers industry’s best pattern-to-specification performance for optimized device yield Underlines ...
Applied Materials, Inc. advanced the state-of-the art in photomask technology with its new Applied Centura Tetra EUV Advanced Reticle Etch system. Overcoming a major hurdle to the adoption of EUV ...
Applied Materials Inc. rolled out two photomask tools today, including the MEBES eXara, a raster scanning electron beam mask writing tool the company claims has significantly higher throughput over ...
TOKYO--(BUSINESS WIRE)--Applied Materials, Inc. today released its Applied Tetra ™ Reticle Clean, the industry’s only wet clean system that delivers damage-free, >99% particle removal efficiency for ...
Applied Materials launched its new Applied Centura Tetra III Advanced Reticle Etch, the system that delivers the nanomanufacturing technology required for etching 45nm photomasks. Save my User ID and ...
Santa Clara, Calif.-based semiconductor manufacturing equipment market leader Applied Materials Inc. today launched its new 45-nm photomask etch technology, dubbed Centura Tetra III Advanced Reticle ...
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