Semiconductor Engineering

HBM Leads The Way To Defect-Free Bumps

High-bandwidth memory stands at the forefront of multiple technology developments as a critical enabler of AI, but it is one of the most difficult modules to manufacture. Leading HBM device makers and ...
Semiconductor Engineering

Challenges Grow For Creating Smaller Bumps For Flip Chips

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...
abc27

Sikama International Exhibits at SMTA's Wafer-Level Packaging Symposium 2023

SANTA BARBARA, CA, UNITED STATES, February 6, 2023 /EINPresswire.com/ -- Sikama International is excited to exhibit at this year's Wafer-Level Packaging Symposium on ...
Nasdaq

Aehr Receives First Order for FOX(TM) Wafer Level Test and Burn-in System to be used for Gallium Nitride Semiconductor Engineering and Qualification

FREMONT, CA / ACCESSWIRE / December 14, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial customer ...
Nasdaq

Aehr Announces Shipment of Initial FOX-XP Wafer-Level Burn-In System for Advanced AI Processors

FREMONT, CA / ACCESS Newswire / February 28, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has completed shipment of its ...